Maximize your TSMC partnership and gain exposure to customer decision makers by becoming a TSMC Europe OIP Ecosystem Forum sponsor!!! Sponsorship opportunities are tiered so that ALL exhibitors, from the largest to the smallest, can participate in this high-profile event.

Sponsorships are available on a first-come, first-served basis, act now to reserve your spot!

A. Bag Insert Sponsorship – (limit 5) - €3,500 excl. VAT

• Insert 1 piece of marketing collateral (bound, up to 6 pages) to 200 attendee tote bags
• Content of insert must be approved by TSMC prior to production and insertion

Sponsorship application deadline is October 16, 2025. Sponsorship participation is contingent upon receipt of the sponsorship fees by November 4, 2025.

To sign up to become a sponsor, please contact Ms. Micky Huang (micky.huang@hwacomms.com)