Join us at the TSMC 2026 China Technology Symposium!
China Technology Symposium
- Date
- June 25, 2026 (Thursday)
- Time
- 9:00a.m. - 4:10p.m.
- Venue
- Shanghai International Convention Center (SHICC)
No.2727, Riverside Avenue, Pudong, Shanghai 200120, China
- Registration will close on 6/22/2026.
Session Catalog (Video on Demand) will be available on July 15, 2026
Website link to be announced in July
Registration will close on 7/10/2026.
Join us to get the latest on:
- TSMC’s industry-leading HPC, Smartphones, IoT, and Automotive platform solutions
- TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond
- TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™
- TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more
- TSMC’s manufacturing excellence, capacity expansion plans, and green manufacturing achievements
- TSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design
For more information on the TSMC Technology Symposium, e-mail us at: symposium@tsmc.com.
We look forward to seeing you at the TSMC 2026 Technology Symposium!
