Join us at the 2024 TSMC Taiwan OIP Ecosystem Forum!
Taiwan OIP Ecosystem Forum (In-Person Event)
Date: November 6, 2024 (Wednesday)
Time:
9:30a.m. - 4:55p.m.
Venue: Sheraton Hsinchu Hotel
No.265, Dong Sec. 1, Guangming 6th Rd., Zhubei City, Hsinchu County 302, Taiwan (R.O.C.)
Taiwan OIP Ecosystem Forum (Online VOD Event)
Date:
November 25, 2024 (Monday)
Website link to be provided in November.
Learn About:
- Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes
- Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications
- Comprehensive design solutions for specialty technologies enabling ultra-low power, ultra-low voltage, analog migration, RF, mmWave, and automotive designs targeting 5G, automotive, and IoT designs
- Ecosystem-specific AI-assisted design flow implementations for 2D and 3DIC design productivity and optimization
- Successful, real-life applications of design technologies, IP solutions, and cloud-based designs from TSMC's Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market.
For more information on the TSMC OIP Ecosystem Forum, e-mail us at: events@pl-marketing.biz.
We look forward to seeing you at the 2024 TSMC OIP Ecosystem Forum!