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| 3DFabric & 3Dblox Track 14:10 – 14:30 |
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A Collaborative Study on 2.5D System in Package for Better Quality and Reliability of High Bandwidth Memory
SK hynix
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Abstract
2.5D floor plan becomes larger with more SoC & HBMs to maximize artificial intelligence (AI) and high performance computing (HPC) performance. Accordingly, mechanical stress in HBM caused by multiple heat and process cycles increases. SKH assembles proxy package with KGSD (known good stack die) cube to mimic 2.5D SiP structure. However, proxy package has challenges in reproducing SiP conditions. For example, the stress level of proxy package is approximately 3 times lower than that of SiP level. In order to overcome the challenges of proxy package, SKH introduces its collaborative work with TSMC in SiP level not only preliminary evaluation via DCTV (daisy chain test vehicle), but also simulation regarding the effect of side mold width and stress reduction of HBM. It would be proven that HBM products with MR-MUF (mass reflow-molded underfill) have superior quality and reliability. |
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