Agenda:In-Person Event

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Join the TSMC 2024 Open Innovation Platform Ecosystem Forum and learn from OIP partners how to leverage their technology for your design challenges!

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Date: Wednesday, September 25, 2024

Time Plenary Session
08:30 - 09:30 Registration & Ecosystem Pavilion
09:30 - 09:45 Welcome Remarks
09:45 - 10:30 Keynote Session by TSMC and Google
10:30 – 11:00 Coffee Break & Ecosystem Pavilion
TSMC Technical Talks
11:00 – 11:30 3Dblox 2024: Maximize 3DIC Design Productivity

TSMC

Energy efficient N2P and A16 SPR Technology Enablement

TSMC

AI-powered EDA Solutions for Design PPA, QoR and Productivity Enhancement

TSMC

OIP Partner Technical Talks
3DFabric & 3Dblox Track HPC & Mobile Track Automotive, IoT & RF Track
11:30 – 11:50 Routing of Multi-Chiplet TSMC 3DFabric technologies

Cadence / AMD

Chiplets and the Arm Chiplet System Architecture

Arm

Groundbreaking SRAM Repair Toolset: Pre-integrated Siemens Tessent MBIST with eMemory’s NeoFuse OTP

eMemory / Siemens EDA

11:50 – 12:10 Architecting next generations Terabit AI networks with Industry’s First Multi-Protocol I/O Connectivity Chiplet

Alphawave Semi / Arm

Broadcom deliver TSMC N3 high performance designs with Cadence AI driven digital full flow

Cadence / Broadcom

Developing Next-Gen Battery Charging Technology Partnering with TSMC and Synopsys for a Sustainable Energy Future

Synopsys / Iontra

12:10 – 12:30 Effective methods to reuse and automate bump creation for chiplets in 3DIC designs

Synopsys / AMD

Thermal modeling of backside power delivery structure –- a N2 process case practice

Ansys

Leveraging AI/ML as the next leap to custom design automation

Cadence / Renesas

12:30 – 13:30 Lunch & Ecosystem Pavilion
13:30 – 13:50 3DIC Physical Implementation and SoIC-X Silicon Testing Results

GUC

Utilizing an AI-powered methodology to achieve SPICE-accurate 7-sigma statistical yield verification

Siemens EDA

A comprehensive IP validation methodology for Microsoft’s AI and high-performance compute chips

Siemens EDA / Microsoft

13:50 – 14:10 Hierarchical flow innovation for Large Silicon Interposer (3X reticle size CoWoS-S) designs for faster turnaround and productivity improvement

Cadence / Broadcom

EDA Flow Cloud Certification – a collaboration between TSMC, AWS and Siemens EDA

Siemens EDA / AWS / TSMC

A Unified AI-Driven Platform for Multi-Die Exploration and Design

Synopsys

14:10 – 14:30 A Collaborative Study on 2.5D System in Package for Better Quality and Reliability of High Bandwidth Memory

SK hynix

Design of vertical fiber-to-chip coupling system in TSMC’s COUPE Silicon Photonics platform for Co-Packaged Optics and In-Package Optical I/O applications

Ansys

New approach that targets EM/IR hotspot analysis and fixing with mPower and Calibre DesignEnhancer

Siemens EDA

14:30 – 14:50 Efficient 3D Chiplet Stacking Using TSMC SoIC Technology

Alchip / Synopsys

Realizing benefits of Backside Power and Clock on TSMC A16 technology node

Synopsys

Enabling a Battery-Free IoT Future: Sofics and ONiO Collaboration on Ultra-Low Leakage ESD Protection

Sofics / ONiO

14:50 – 15:10 Ansys-Synopsys-TSMC Solve the 3DIC Multiphysics Challenges

Synopsys / Ansys

Advanced Verification of Microsoft MAIA AI Processor 3DIC

Siemens EDA / Microsoft

Accelerating the Verification of High-Frequency Mixed-Signal Components via Jivaro Pro Advanced Parasitic Reduction

Silvaco / Silicon Creations

15:10 – 15:30 Coffee Break & Ecosystem Pavilion
15:30 – 15:50 Simplifying requirements and flows of SoIC technology for Stacked die design with TSMC 3Dblox and Cadence Integrity 3D-IC Platform

Cadence / GUC

Secure remote debug with Siemens Calibre in Azure Modeling and Simulation Workbench

Microsoft / Siemens EDA

GDDR Memory for High-Performance AI Inference

Cadence / Rambus

15:50 – 16:10 HBM3/HBM3E Implementation Challenges When Integrating Memory Controllers with Physical Layer Solutions, and How to Overcome them

Rambus / Cadence

Mastering the Timing Closure Maze for Enhanced Productivity and Efficiency

Cadence / Intel

Revolutionizing RC Parasitic Extraction: The Power of StarRC Hybrid Extraction

Synopsys / TSMC

16:10 – 16:30 Multi-die design for TSMC COUPE with unified electronic and photonic design solutions

Synopsys / Ansys

Leveraging AI to accelerate debug with Calibre Design Solutions

Siemens EDA

Chip Design - Cloud and Efficiency

Google

16:30 – 16:50 The Future of Hardware Technologies for Computing

Stanford University

The Future of Hardware Technologies for Computing

Stanford University

The Future of Hardware Technologies for Computing

Stanford University

16:50 – 18:00 Networking and Reception

*The agenda is subject to change by TSMC.