Agenda:In-Person Event

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Join the TSMC Open Innovation Platform Ecosystem Forum Japan 2024 and learn from OIP partners how to leverage their technology for your design challenges!

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Date: Friday, October 25, 2024

Time Plenary Session
08:30 - 09:30 Registration & Ecosystem Pavilion
09:30 - 09:45 Welcome Remarks
09:45 - 10:00 Guest Speech
10:00 - 10:30 TSMC Keynote
10:30 – 11:00 Coffee Break & Ecosystem Pavilion
TSMC Technical Talks
11:00 – 11:30 3Dblox 2024: Maximize 3DIC Design Productivity

TSMC

AI-powered EDA Solutions for Design PPA, QoR and Productivity Enhancement

TSMC

OIP Partner Technical Talks
HPC & 3DFabric Track Mobile, IoT & Automotive Track
11:30 - 11:50 Routing of Multi-Chiplet TSMC 3DFabric technologies

Cadence / AMD

AI-Driven Analog Design Migration Solution Tuned for TSMC Technology Platforms

Synopsys

11:50 - 12:10 Effective methods to reuse and automate bump creation for chiplets in 3DIC designs

Synopsys / AMD

Leveraging AI/ML as the next leap to custom design automation

Cadence / Renesas

12:10 - 12:30 Electro-Thermal Modeling and Simulation for Thermal Management in Co-Packaged Optics

Cadence

New approach that targets EM/IR hotspot analysis and fixing with mPower and Calibre DesignEnhancer

Siemens EDA

12:30 – 13:30 Lunch & Ecosystem Pavilion
13:30 – 13:50 Simplifying requirements and flows of SoIC technology for Stacked die design with TSMC 3Dblox and Cadence Integrity 3D-IC Platform

Cadence / GUC

Realtime Safety Monitoring for Automotive Electronics based on Deep Data

proteanTecs

13:50 - 14:10 Multi-die design for TSMC COUPE with unified electronic and photonic design solutions

Synopsys / Ansys

A comprehensive IP validation methodology for Microsoft’s AI and high-performance compute chips

Siemens EDA / Microsoft

14:10 – 14:30 Efficient 3D Chiplet Stacking Using TSMC SoIC Technology

Alchip / Synopsys

Enabling a Battery-Free IoT Future: Sofics and ONiO Collaboration on Ultra-Low Leakage ESD Protection

Sofics / ONiO

14:30 – 14:50 Distributed and GPU-accelerated 3D EM Simulations for IC and 3DIC Silicon Photonics Applications with Peakview

Lorentz Solution / NVIDIA

A highly parallelizable Time Dependent Dielectric Breakdown (TDDB) solution readiness for TSMC automotive platform

Ansys

14:50 – 15:20 Coffee Break & Ecosystem Pavilion
15:20 – 15:40 3DIC Physical Implementation and SoIC-X Silicon Testing Results

GUC

Soft Error Simulation Tool to Create an N3E SER Library

IROC Technologies

15:40 – 16:00 Architecting next generations Terabit AI networks with Industry’s First Multi-Protocol I/O Connectivity Chiplet

Alphawave Semi / Arm

Low-Power Communication IC Design Verified by AI-Powered Simulation Flow

Siemens EDA / THine Electronics

16:00 – 16:20 Design of vertical fiber-to-chip coupling system in TSMC’s COUPE Silicon Photonics platform for Co-Packaged Optics and In-Package Optical I/O applications

Ansys

Smart Optimization and Timing Closure for Automotive Designs-Block Level to Full-Chip

Cadence / Renesas Electronics

16:20 – 17:30 Closing Reception

*The agenda is subject to change by TSMC.