Join us at the TSMC Open Innovation Platform Ecosystem Forum Japan 2024!

Japan OIP Ecosystem Forum

Date: Friday, October 25

Time: 9:30a.m. - 5:30p.m.

Venue: Grand Hyatt Tokyo

6-10-3, Roppongi, Minato-ku, Tokyo 106-0032

Registration will be closed on Wednesday, October 9. Seats are limited.

VOD (Video on Demand) will be available starting from Monday, November 18, 2024

Registration will close on Monday, November 11, 2024.

Learn About:

• Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS^®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications
• Comprehensive design solutions for specialty technologies enabling ultra-low power, ultra-low voltage, analog migration, RF, mmWave, and automotive designs targeting 5G, automotive, and IoT designs
• Ecosystem-specific AI-assisted design flow implementations for 2D and 3DIC design productivity and optimization
• Successful, real-life applications of design technologies, IP solutions, and cloud-based designs from TSMC's Open Innovation Platform^® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market.