TSMC OIP Ecosystem Forum

Date: November 13, 2024 (Wednesday)

Time: 9:30a.m. - 4:35p.m.

Venue: Hyatt Regency Beijing Wangjing

Lei Shing Hong Center, 8 Guangshun South Street, Chaoyang District, Beijing, 100102 Greater China

Date: November 25, 2024 (Monday)

Website link to be provided in November.

Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes
Latest updates on TSMC 3DFabric chip stacking and advanced packaging processes, InFO, CoWoS^®, and SoIC, 3DFabric Alliance, and 3Dblox standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications
Comprehensive design solutions for specialty technologies enabling ultra-low power, ultra-low voltage, analog migration, RF, mmWave, and automotive designs targeting 5G, automotive, and IoT designs
Ecosystem-specific AI-assisted design flow implementations for 2D and 3DIC design productivity and optimization
Successful, real-life applications of design technologies and IP solutions from TSMC's Open Innovation Platform Ecosystem members and TSMC customers to speed up time-to-design and time-to-market

For more information on the TSMC OIP Ecosystem Forum, e-mail us at: events@pl-marketing.biz.

We look forward to seeing you at the 2024 TSMC OIP Ecosystem Forum!