TSMC OIP - Session Information

HPC & 3DFabric Track 17:00 – 17:30

Real Examples of 3D Heterogeneous Integration Using the TSMC 3Dblox Standard

Synopsys

Abstract
The industry is recognizing the immense benefits of integrating heterogeneous dies or chiplets in a single package to scale functionality, increase compute performance, and gain product portfolio flexibility. However, to get there as an industry, we need to come together to provide solutions that include a single environment to explore early design architecture, achieve efficient design implementation, and address system analysis concerns.

TSMC is one of the leaders to deliver solutions for 2.5D and 3D heterogeneous integration, easing the shift to multi-die systems. One of the solutions is the introduction of 3Dblox, which models, in one format, the key physical stacking and the logical connectivity information in 3D IC designs. In collaboration with TSMC, Synopsys delivers solutions and technologies that are optimized for the TSMC standard so mutual customers can continue to differentiate and innovate. The Synopsys 3DIC Compiler, a unified die/package exploration, co-design and analysis platform, supports the TSMC 3Dblox standard.

This presentation uses case studies to highlight the latest advancements in 3DIC Compiler for multi-die systems using TSMC’s 3Dblox technologies. The presentation outlines the feasibility study of 3D IC designs with IR and thermal effects combined with robust support for the full set of chiplet orientations. The case studies illustrate enhanced routing of UCIe die-to-die and HBM interfaces and how test probes can be used to automate the design-for-test methodology.

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