Agenda:In-Person Event

Register Now!

Join the TSMC 2023 Open Innovation Platform Ecosystem Forum and learn from OIP partners how to leverage their technology for your design challenges!

Register Now

Date: Wednesday, October 4, 2023

Time Plenary Session
08:30 - 09:30 Registration & Ecosystem Pavilion
09:30 - 09:40 Welcome Remarks
09:40 - 10:40 TSMC Keynote & Guest Speech
10:40 – 11:00 Coffee Break & Ecosystem Pavilion
11:00 – 11:30 TSMC 3Dblox™ Talk

TSMC

TSMC 3DFabric™ Talk

TSMC

TSMC Analog Migration Talk

TSMC

HPC & 3DFabric Track Mobile & Automotive Track IoT, RF & Other Track
11:30 – 12:00 A Case Study Demonstrating the Advantages of 224G Interconnects and 3DIC Architectures for Artificial Intelligence ICs

Alchip / Synopsys

Gaining PPA (3.4+GHz) & Productivity advantage on TSMC N3E Implementation of Arm Cortex-X4 and Next-Gen CPUs using Cadence Solutions

Cadence / ARM

Synopsys/Ansys/Keysight RF Reference Design Flow on TSMC Advanced N4P Process

Synopsys / Keysight / Ansys

12:00 - 12:30 Addressing reliability challenges with aging-aware STA for advanced nodes

Cadence / nVidia

Demonstrating Technology PPA Entitlement with TSMC’s N2 Technology on HPC Design Using Synopsys Fusion Compiler

Synopsys

mm-wave Communication Circuits in 16nm FinFET

KU Leuven

12:30 – 13:30 Lunch & Ecosystem Pavilion
13:30 – 14:00 GUC’s Chiplet Solutions from 2.5D to 3D

GUC

Achieving TSMC N3 and N2 design goals using Cadence Cerebrus AI enabled digital full flow

Cadence

Synopsys AI-based Analog Design Migration Flow for TSMC Advanced Technologies

Synopsys

14:00 – 14:30 Using 3Dblox to simplify and automate 3DFabric design

Cadence

Unlocking the Power of Data: Enabling a Safer Future for Automotive Systems

proteanTecs

Novel Computing Paradigm based on Oscillatory Neural Networks for Energy Efficient Edge AI

Eindhoven University of Technology

14:30 – 15:00 Real Examples of 3D Heterogeneous Integration Using the TSMC 3Dblox Standard

Synopsys

New Approach to lower Jitter in a PLL

Technical University of Munich

A methodology for PDK migration and validation integrated in Virtuoso Studio

Cadence

15:00 – 15:30 Coffee Break & Ecosystem Pavilion
15:30 – 16:00 The Rise of Chiplets in Advanced AI / ML / High Performance Compute SoC's

Credo Semiconductor

Optimizing compute density for SiFive RISC-V processors in TSMC advanced nodes with Synopsys Fusion QuickStart Implementation Kits

Synopsys / SiFive

Cisco Characterization using PrimeLib on Synopsys Cloud for TSMC Advanced Node Libraries

Synopsys / Cisco

16:00 – 16:30 Enabling Realistic Disaggregated System through UCIe Interconnect and Chiplets-based design.

Alphawave Semi

On-Die Power Management IP's for SoCs and Chiplets on N3P Process

Analog Bits

Attacking resistance, the key limiter in achieving EMIR clean results, with layout modifications

Siemens EDA / MediaTek

16:30 – 17:00 Massive Parallel Oscillator Networks to Solve NP-hard Combinatorial Optimization Problems

TU Darmstadt

Enabling the automotive chiplet ecosystem

Imec

Custom Design Migration in Virtuoso Studio: A comprehensive solution for migration across nodes

Cadence

17:00 – 17:30 Synopsys SLM PVT Monitor IP readiness on TSMC N3E/N3P/N3AE

Synopsys

Analog Computing based on Oscillatory Neural Networks for Solving Combinatorial Optimization Problems.

LIRMM

Ultra low power analog front ends and digitizers

Eindhoven University of Technology

17:30 - 18:30 Networking and Reception

*The agenda is subject to change by TSMC.